Multi-slicing of semiconductors by wire electrical discharge machining technology

被引:0
作者
Okamoto Y.
Okada A.
机构
来源
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering | 2017年 / 83卷 / 09期
关键词
Electrical discharge machining; Multi-slicing; Multi-wire; Semiconductor; Wire edm;
D O I
10.2493/jjspe.83.825
中图分类号
学科分类号
摘要
[No abstract available]
引用
收藏
页码:825 / 828
页数:3
相关论文
共 5 条
[1]  
Uno Y., Okada A., Okamoto Y., Hirano R., Wire EDM slicing of monocrystalline silicon ingot, Proc. of 15th American Society for Precision Engineering Annual Meeting, (2000)
[2]  
Okamoto Y., Uno Y., Okada A., Ohshita S., Hirano T., Takata S., Development of multi-wire EDM slicing method for silicon ingot, Proc. of American Society for Precision Engineering 2008 Annual Meeting and the 12th ICPE, (2008)
[3]  
Itokazu A., Miyake H., Hashimoto T., Fukushima K., Multiwire electrical discharge slicing for silicon carbide part 2: Improvement on manufacturing wafers by forty-wire EDS, Materials Science Forum, 778, 780, (2014)
[4]  
Okamoto Y., Suzuki A., Kimura A., Okada A., Kurihara H., Kido M., Development of simple power supplying system in multiwire EDM slicing method, Proceedings of 29th Annual Meeting of the American Society for Precision Engineering, (2014)
[5]  
Okamoto Y., Ikeda T., Kurihara H., Okada A., Kido M., Multiwire EDM slicing of semiconductors with group power supplying method, Proc. of Euspen's 17th International Conference, (2017)