Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate

被引：0
|
作者：
Yoon, Jeong-Won [1 ]
Lee, Chang-Yong [1 ]
Lee, Chang-Bae [2 ]
Yoo, Choong-Sik [2 ]
Jung, Seung-Boo [1 ]
机构：
[1] Advanced Materials and Process Research Center for IT, SungKyunKwan University, 300 Chunchun-dong, Jangan-gu, Suwon,440-746, Korea, Republic of
[2] Material Research Lab. R and D Center, SAMSUNG ELECTRO-MECHANICS Co., Paldal-gu, Suwon, Korea, Republic of
来源：
| 2003年 / Walter de Gruyter GmbH卷 / 94期
关键词：
This work was supported by the Advanced Materials and Process Research Center for IT at Sungkyunkwan University; Korea (Grant No. R12-2002-057-03001-0);
D O I：
10.1515/ijmr-2003-0078
中图分类号：
学科分类号：
摘要：
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