Nanomechanical characterisation of MEMS thin film materials

被引:0
|
作者
He, J.H. [1 ,2 ]
Luo, J.K. [2 ,3 ]
Hopcroft, Matt A. [2 ]
Le, H.R. [2 ]
Moore, D.F. [2 ]
机构
[1] Institute of Microelectronics, Singapore 117685
[2] Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, Trumpington Street
[3] Centre for Material Research and Innovation, University of Bolton, Bolton BL3 5AB, Deane Road
关键词
Cantilevers; Elastic modulus; Mechanical characterisation; MEMS; Nanoindentation; NEMS; Resonance frequency;
D O I
10.1504/IJCMSSE.2009.027491
中图分类号
学科分类号
摘要
Mechanical characterisation of thin film is crucial for development of MEMS/NEMS devices. A simple mechanical characterisation method is developed using a surface profilometer. Surface profilometer is used to scan along the micromachined cantilevers and produce the bending profile, from which the Young's modulus can be extracted. The following MEMS materials: SiN, Ni, Ni/SiN bimorph, Nanocrystal Diamond (ND), SiC have been characterised. The results are compared and in agreement with those obtained from nanoindentation and resonance frequency method. The advantages and disadvantages of these three methods are discussed. Copyright © 2009, Inderscience Publishers.
引用
收藏
页码:342 / 354
页数:12
相关论文
共 50 条
  • [21] Comparative analysis of thermally evaporated nanoscale CdS thin film's structural, morphological, optical and nanomechanical properties
    Gaur, Shailendra Kumar
    Chaudhary, Ashwani
    Murtaza, Qasim
    Mishra, R. S.
    JOURNAL OF MOLECULAR STRUCTURE, 2025, 1324
  • [22] Nanomechanical characterization of sputtered RuO2 thin film on silicon substrate for solid state electronic devices
    Zhu, Jing
    Yeap, Kong Boon
    Zeng, Kaiyang
    Lu, Li
    THIN SOLID FILMS, 2011, 519 (06) : 1914 - 1922
  • [23] Performance of thin film silicon MEMS on flexible plastic substrates
    Patil, S. B.
    Chu, V.
    Conde, J. P.
    SENSORS AND ACTUATORS A-PHYSICAL, 2008, 144 (01) : 201 - 206
  • [24] Low-temperature thin-film silicon MEMS
    Conde, JP
    Gaspar, J
    Chu, V
    THIN SOLID FILMS, 2003, 427 (1-2) : 181 - 186
  • [25] Thin FC film for sidewall passivation in SCREAM process for MEMS
    Vrtacnik, D.
    Resnik, D.
    Aljancic, U.
    Mozek, M.
    Penic, S.
    Amon, S.
    2007 AFRICON, VOLS 1-3, 2007, : 1281 - 1284
  • [26] Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices
    Zaal, Jeroen J. M.
    van Driel, Willem D.
    Zhang, G. Q.
    SENSORS, 2010, 10 (04) : 3989 - 4001
  • [27] Thin Film PZT Multimode Resonant MEMS Temperature Sensor
    Sui, Wen
    Kaisar, Tahmid
    Wang, Haoran
    Wu, Yihao
    Lee, Jaesung
    Xie, Huikai
    Peng, Philip X-L
    2022 IEEE SENSORS, 2022,
  • [28] Wafer-level thin-film encapsulation for MEMS
    O'Mahony, Conor
    Hill, Martin
    Olszewski, Zbigniew
    Blake, Alan
    MICROELECTRONIC ENGINEERING, 2009, 86 (4-6) : 1311 - 1313
  • [29] Bulk and surface micromachined MEMS in thin film SOI technology
    Raskin, J. -P.
    Iker, F.
    Andre, N.
    Olbrechts, B.
    Pardoen, T.
    Flandre, D.
    ELECTROCHIMICA ACTA, 2007, 52 (08) : 2850 - 2861
  • [30] Diamond thin film micro-package for MEMS resonator
    Zhu, Xiangwei
    Aslam, Dean M.
    Sepulveda, Nelson
    Sullivan, J. P.
    2006 1ST IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3, 2006, : 1280 - +