Effects of fluoride residue on thermal stability in Cu/porous low-k interconnects

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20142917949407
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(1) FUJITSU LABORATORIES Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan | 1600年 / American Institute of Physics Inc.期
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We have investigated the effects of fluoride residue on the thermal stability of a Cu/barrier metal (BM)/porous low-k film (k;
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106167
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