On the relationship between the microstructure and electrical resistivity of copper used in superconducting composites

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作者：
机构：
[1] Polikarpova, M.V.
[2] Kozlenkova, N.I.
[3] Nikulin, A.D.
[4] Shikov, A.K.
[5] Pantsyrnyi, V.I.
[6] Vorob'eva, A.E.
[7] Dergunova, E.A.
[8] Popova, E.N.
[9] Rodionova, L.A.
来源：
Polikarpova, M.V. | 2001年 / Nauka, Ekaterinburg卷 / 91期
关键词：
Electric conductivity - Grain boundaries - Impurities - Metallic matrix composites - Microstructure - Oxygen - Superconducting materials;
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摘要：
The relationship between the electrical conductivity and microstructure of copper samples of 99.99wt % purity obtained by vacuum electron-beam melting has been studied. The microstructure was studied by transmission electron microscopy and optical metallography. The analysis of the content of impurity elements was performed by mass spectrography and laser mass spectrometry. A correlation was established between the parameter R273K/R4.2K, the concentration of oxygen, and the amount of precipitates in copper. The difference in the values of the parameter R273K/R4.2K observed in the samples studied was shown to be due to differences in microstructure features such as the extension of grain boundaries and the concentration of precipitates of second phases.
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