Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5grains on Cu substrates

被引：0

作者：

Yang, Ming ^{[1
]}

Ko, Yong-Ho ^{[1
,2
]}

Bang, Junghwan ^{[1
]}

Kim, Taek-Soo ^{[2
]}

Lee, Chang-Woo ^{[1
]}

Zhang, Shuye ^{[2
]}

Li, Mingyu ^{[3
]}

机构：

[1] Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Incheon,21999, Korea, Republic of

[2] Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon,34141, Korea, Republic of

[3] Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen,518055, China

来源：

Journal of Alloys and Compounds | 2017年 / 701卷

关键词：

Growth kinetics - Lead-free solders - Reaction kinetics - Intermetallics;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：533 / 541