FAI: An ounce of prevention, worth a pound of cure

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作者：

机构：

[1] Khan, Zulki

来源：

Khan, Z. | 1600年 / PennWell Corporation卷 / 28期

关键词：

Device packaging - Package on packages - Real estate - Ultra fine pitch;

D O I：

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摘要：

Shrinking PCB real estate, ultrafine-pitch devices, package-on-package technologies, thinner boards, and the recent adoption of challenging device packaging give the use of first article inspection greater importance.

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