Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

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[1] [1,Marques, V.M.F.
[2] Johnston, C.
[3] Grant, P.S.
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Marques, V.M.F. (vitorfarinhamarques@gmail.com) | 1600年 / Elsevier Ltd卷 / 613期
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摘要：
Scanning electron microscopy
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