Permanently resistant: High-temperature IMD ink system

被引：0

作者：

机构：

[1] Kowalski, P.

来源：

Kowalski, P. (wug@proell.de) | 2001年 / Carl Hanser Verlag卷 / 91期

关键词：

Adhesion - Film preparation - Heat resistance - Injection molding - Ink - Optical resolving power - Polycarbonates - Thermal stress - Thermoplastics;

D O I：

暂无

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学科分类号：

摘要：

In-mold decoration (IMD) technology was used to develop a screen-printing ink system with the ability to withstand temperature over 300°C. The high-flexibility screen printing ink fulfilled extreme demands for adhesion, forming and resistance to thermal stresses and shearing during injection molding. Polycarbonate films were screen printed on reverse side and then formed, trimmed and back-molded on the printed side with a polycarbonate (PC) resin. The analysis showed that the ink system had good adhesion to PC films and ensured permanent bonding to back-molded polymers.

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