Emerging flip chip and WL-CSP technologies

被引：0
|
作者：
Lanzone, Bob [1 ]
机构：
[1] Unitive Adv. Semiconductor Packaging, 4512 S. Miami Blvd., Res. Triangle Park, NC 27709-4584, United States
来源：
SMT Surface Mount Technology Magazine | 2002年 / 15卷 / 08期
关键词：
Chip scale packages - Curing - Dielectric materials - Electroplating - Integrated circuit manufacture - Masks - Soldering;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The use of flip chip and wafer-level chip scale packaging (WL-CSP) techniques in providing reliable interconnect and packaging technologies was presented. The large solder spheres for WL-CSP was created using electroplating methods which employs photoimageable stencil to create the plating mask or template. It is shown that the flip chip and WL-CSP technique meets the requirement for smaller, faster and cheaper alternatives for a broad array of applications.
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页码：44 / 46
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