Optimization of Johnson-Cook constitutive model for lead-free solder using genetic algorithm and finite element simulations

被引：0
作者：
Liu, D.S. [1 ]
Hsu, C.L. [1 ]
机构：
[1] Advanced Institute of Manufacturing for High-tech Innovations, Department of Mechanical Engineering, National Chung Cheng University, Chia-yi County
来源：
Computers, Materials and Continua | 2014年 / 40卷 / 03期
关键词：
Finite element simulations; Genetic algorithm; Johnson-Cook constitutive model; Lead-free solder; Micro-impact test;
D O I：
10.3970/cmc.2014.040.165
中图分类号：
学科分类号：
摘要：
To ensure the reliability of microelectronics packages, the high strain rate deformation behavior of the solder joints must be properly understood. Accordingly, the present study proposes a hybrid experimental / numerical method for determining the optimal constants of the Johnson-Cook (J-C) constitutive model for 96.5Sn-3Ag-0.5Cu (SAC305) solder alloy. In the proposed approach, FEM simulations based on the J-C model are performed to describe the load-time response of an SAC305 ball solder joint under an impact velocity of 0.5 m/s. The optimal values of the constitutive model are then determined using an iterative Genetic Algorithm approach based on a comparison of the simulated load-time response and the experimental load-time response. The optimality of the optimized constants is demonstrated by comparing the experimental and simulation results for the load-time curves under impact speeds of 0.3 ∼ 1.0 m/s. It is shown that a good agreement exists between the two sets of results for all values of the impact speed. In other words, the results confirm the validity of the proposed hybrid approach as a means of evaluating the high strain-rate response of lead-free solder. Copyright © 2014 Tech Science Press.
引用
收藏
页码：165 / 178
页数：13
相关论文
共 18 条
  • [1] Amagai M., Watanabe M., Omiya M., Kishimoto K., Shibuya T., Mechanical characterization of Sn-Ag-based lead-free solders, Microelectronics Reliability, 42, 6, pp. 951-966, (2002)
  • [2] Chen T.Y., Chen C.J., Improvements of simple genetic algorithm in structural design, International Journal for Numerical Methods in Engineering, 40, pp. 1323-1334, (1997)
  • [3] Hallquist J.O., LS-DYNA Keyword User's Manual (Version 971), (2007)
  • [4] Johnson G.R., Cook W.H., A constitutive model and data for metals subjected to large strains, high strain rates and high temperatures, Proceedings of the 7th International Symposium on Ballistics, pp. 541-547, (1983)
  • [5] Kim K.S., Huh S.H., Suganuma K., Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys, Materials Science & Engineering a, 333, pp. 106-114, (2002)
  • [6] Kanchanomai C., Miyashita Y., Mutoh Y., Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders, Journal of Electronic Materials, 31, 5, pp. 456-465, (2002)
  • [7] Lee S.W.R., Dai L.H., Characterization of strain rate-dependent behavior of 63Sn-37Pb solder using split hopkinson torsional bars(SHTB), Proceedings of the 13th Symposium on Mechanics of SMT & Photonic Structures, pp. 1-6, (2001)
  • [8] Lall P., Shantaram S., Suhling J., Locker D., Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys, Proceedings of the 62nd Electronic Components & Technology Conference, pp. 1313-1326, (2012)
  • [9] Liu D.S., Tsai C.Y., Lyu S.R., Determination of temperature-dependent elasto-plastic properties of thin-film by MD nanoindentation simulations and an inverse GA/FEM computational scheme, CMC: Computers Materials & Continua, 11, 2, pp. 147-164, (2009)
  • [10] Niu X., Yuan G., Li Z., Shu X., Study on dynamic failure model of lead-free solders using SHPB techniques, International Journal of Modern Physics B, 22, 9-11, pp. 1117-1122, (2008)
12