Optimization of Johnson-Cook constitutive model for lead-free solder using genetic algorithm and finite element simulations

被引:0
作者
Liu, D.S. [1 ]
Hsu, C.L. [1 ]
机构
[1] Advanced Institute of Manufacturing for High-tech Innovations, Department of Mechanical Engineering, National Chung Cheng University, Chia-yi County
关键词
Finite element simulations; Genetic algorithm; Johnson-Cook constitutive model; Lead-free solder; Micro-impact test;
D O I
10.3970/cmc.2014.040.165
中图分类号
学科分类号
摘要
To ensure the reliability of microelectronics packages, the high strain rate deformation behavior of the solder joints must be properly understood. Accordingly, the present study proposes a hybrid experimental / numerical method for determining the optimal constants of the Johnson-Cook (J-C) constitutive model for 96.5Sn-3Ag-0.5Cu (SAC305) solder alloy. In the proposed approach, FEM simulations based on the J-C model are performed to describe the load-time response of an SAC305 ball solder joint under an impact velocity of 0.5 m/s. The optimal values of the constitutive model are then determined using an iterative Genetic Algorithm approach based on a comparison of the simulated load-time response and the experimental load-time response. The optimality of the optimized constants is demonstrated by comparing the experimental and simulation results for the load-time curves under impact speeds of 0.3 ∼ 1.0 m/s. It is shown that a good agreement exists between the two sets of results for all values of the impact speed. In other words, the results confirm the validity of the proposed hybrid approach as a means of evaluating the high strain-rate response of lead-free solder. Copyright © 2014 Tech Science Press.
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页码:165 / 178
页数:13
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