Photoimageable thick-film components for a ceramic analytical microsystem

被引:0
|
作者
Department of Electronics, AOH University of Science and Technology, Al. Mickiewicza 30, 30-059 Cracow, Poland [1 ]
不详 [2 ]
机构
来源
J. Microelectron. Electron. Packag. | 2008年 / 1卷 / 8-11期
关键词
Thick films;
D O I
10.4071/1551-4897-5.1.8
中图分类号
学科分类号
摘要
引用
收藏
页码:8 / 11
相关论文
共 50 条
  • [31] Thick-Film Ceramic Strain Sensors for Structural Health Monitoring
    Jabir, Saad A. A.
    Gupta, Naren K.
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2011, 60 (11) : 3669 - 3676
  • [32] An X-band TFMS rat-race coupler using photoimageable thick-film materials
    Ng, CY
    Chongcheawchamnan, M
    Aftanasar, MS
    Robertson, ID
    Minalgiene, J
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2002, 32 (01) : 5 - 7
  • [33] Miniature X-band branch-line coupler using photoimageable thick-film materials
    Ng, CY
    Chongcheawchamnan, M
    Aftanasar, MS
    Robertson, ID
    Minalgiene, J
    ELECTRONICS LETTERS, 2001, 37 (19) : 1167 - 1168
  • [34] Multilayer thick-film ceramic for multichip modules with laser microvias
    Loeffler, Sebastian
    Mauermann, Christopher
    Rebs, Angela
    Reppe, Guenter
    MICROELECTRONICS INTERNATIONAL, 2018, 35 (03) : 158 - 163
  • [35] Embedding ceramic thick-film capacitors into printed wiring boards
    Borland, W
    Doyle, M
    Dellis, L
    Renovales, O
    Majumdar, D
    Materials, Integration and Packaging Issues for High-Frequency Devices II, 2005, 833 : 143 - 151
  • [36] ADJUSTABLE REACTIVE COMPONENTS FOR DIRECT MOUNTING ON THICK-FILM SUBSTRATES
    WEBER, RL
    PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1968, (MAY): : 191 - &
  • [37] A THICK-FILM TELEVISION VIDEO IF AMPLIFIER USING COMPATIBLE COMPONENTS
    WEBER, RL
    PRABHAKA.JC
    IEEE TRANSACTIONS ON BROADCAST AND TELEVISION RECEIVERS, 1967, BT13 (03): : 7 - &
  • [38] THICK-FILM TECHNOLOGY
    PRUDENZIATI, M
    SENSORS AND ACTUATORS A-PHYSICAL, 1991, 25 (1-3) : 227 - 234
  • [39] MODERN THICK-FILM AND LTCC PASSIVES AND PASSIVE INTEGRATED COMPONENTS
    Dziedzic, Andrzej
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2009, 39 (04): : 191 - 200
  • [40] Multi-layer thick-film microwave components and measurements
    Tian, ZR
    Free, C
    Aitchison, C
    2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 394 - 399