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- [24] Interface engineering to decrease interdif fusion and improve thermal stability of EUV multilayer Yu, B. (yubodisan@126.com), 1600, Science Press (11):
- [25] Enhanced Interfacial Adhesion and Thermal Stability in Bismuth Telluride/Nickel/Copper Multilayer Films with Low Electrical Contact Resistance ADVANCED MATERIALS INTERFACES, 2018, 5 (23):
- [29] THERMAL-STABILITY OF ENCAPSULATED TUNGSTEN CARBON MULTILAYER THIN-FILMS JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (04): : 2286 - 2291