Vascular Polymer Encapsulation for Integrated Thermal Management and Packaging of Electronics

被引：0

作者：

Coppola, Anthony ^{[1
]}

Fatemi, Alireza ^{[1
]}

机构：

[1] Research and Development General Motors, Warren,MI, United States

来源：

2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings | 2021年

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Combustion - Timing circuits - Thick films - Plates (structural components) - Plate metal - Integrated circuits - Electronics packaging - Temperature control

引用

页码：5634 / 5641

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