Numerical Simulation and Optimization of Dispensing for Optical Slices

被引：0

作者：

Wu L. ^{[1
]}

Gao W. ^{[1
]}

Dun A. ^{[1
]}

Yang M. ^{[1
]}

Wei C. ^{[1
]}

Xu X. ^{[1
]}

Shao J. ^{[1
]}

机构：

[1] Key Laboratory of Materials for High Power Laser, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai

来源：

Xu, Xueke (xuxk@siom.ac.cn) | 1600年 / Science Press卷 / 44期

关键词：

Dispensing process; Materials; Numerical simulation; Polishing;

D O I：

10.3788/CJL201744.0803001

中图分类号：

学科分类号：

摘要：

By using the thermoelastic model, the finite element analysis of dispensing process of optical slices is performed. The process parameters which influence the surface deformation of workpieces (Δp) after dispensing are optimized. For an optical slice with a diameter of 100 mm and a thickness of 2 mm, a thin base plate with high elastic modulus and low thermal expansion coefficient is the optimal selection. Δp decreases with the decreases of radius, number and elastic modulus of glue dots. The glue dot position should avoid the high Δp zones. The thermal expansion coefficient of glue dots has little influence on Δp. © 2017, Chinese Lasers Press. All right reserved.

引用

共 9 条

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