Static Mechanical Relaxation Characteristics of Polymethyl Methacrylate in Solid-Like State

被引:0
|
作者
Li R. [1 ]
Wu D. [1 ,2 ]
Liu Y. [1 ]
Wang Q. [1 ]
Xu H. [1 ]
Sun J. [1 ]
机构
[1] Institute of Plastic Machinery and Plastic Engineering (IPME), Beijing University of Chemical Technology, Beijing
[2] Engineering Research Center for Polymer Processing Equipment, Ministry of Education, Beijing
来源
Wu, Daming (wudaming@vip.163.com) | 2018年 / Sichuan University卷 / 34期
关键词
Creep; Holding time; Isothermal hot embossing in solid-like state; Polymethyl methacrylate; Stress relaxation;
D O I
10.16865/j.cnki.1000-7555.2018.07.010
中图分类号
学科分类号
摘要
In order to investigate the static mechanical relaxation characteristics(creep and stress relaxation) of polymethyl methacrylate (PMMA) in the temperature zone of solid-like state, the creep experiments were carried out at different temperatures in the pressure-holding mode, and the modeling results of generalized Kelvin model, the standard linear model and the three-component correction model were analyzed. According to the stress relaxation experiments in constant strain at different temperatures and the parameters of the three-component correction model, which has best fitting effect, the expression of relaxation modulus was derived. Also, combined with the theoretical model, the experiments of the hemisphere array and Prism microstructure at different temperatures and different holding time were conducted by the novel method of isothermal hot embossing in solid-like state, and it provided experimental and theoretical basis for obtaining the process of isothermal hot embossing in solid-like state based on high replication precision and short embossing cycle. © 2018, Editorial Board of Polymer Materials Science & Engineering. All right reserved.
引用
收藏
页码:54 / 59
页数:5
相关论文
共 13 条
  • [1] Kittel C.A., Introduction to solid state physics, Am. J. Phys., 21, pp. 547-548, (1954)
  • [2] Woo Y.S., Dong E.L., Lee W.I., Molecular dynamic studies on deformation of polymer resist during thermal nano imprint lithographic process, Tribol. Lett., 36, pp. 209-222, (2009)
  • [3] Sok R.M., Berendsen H.J.C., Gunsteren W.F.V., Molecular dynamics simulation of the transport of small molecules across a polymer membrane, J. Chem. Phys., 96, pp. 4699-4704, (1992)
  • [4] Yang Z.Z., The study of polymer micro-structure plate to plate hot embossing process, (2015)
  • [5] Jing P.S., The study of polymer surface micro-structure flat hot embossing process and equipment, (2014)
  • [6] Wu D., Sun J., Liu Y., Et al., Rapid fabrication of microstructure on PMMA substrate by the plate to plate transition-spanning isothermal hot embossing method nearby glass transition temperature, Polym. Eng. Sci., 57, (2017)
  • [7] Sun J.Y., Wu D.M., Liu Y., Et al., Polymer micro-nano manufacturing technology, China Rubber/Plastics Technology and Equipment, 10, pp. 1-9, (2016)
  • [8] Juang Y.J., Lee L.J., Koelling K.W., Rheological analysis of polyvinyl butyral near the glass transition temperature, Polym. Eng. Sci., 41, pp. 275-292, (2010)
  • [9] Yi-Je J., James L.L., Koelling K.W., Hot embossing in microfabrication. Part I: Experimental, Polym. Eng. Sci., 42, pp. 539-550, (2002)
  • [10] Yi-Je J., James L.L., Koelling K.W., Hot embossing in microfabrication. Part II: Rheological characterization and process analysis, Polym. Eng. Sci., 42, pp. 551-566, (2002)