Fabrication and high temperature tribological properties of WC reinforced W-Cu composites

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作者
Huang, Youting [1 ,2 ]
Li, Xiaowei [1 ,2 ]
Zha, Yuanfei [1 ,2 ]
Zhou, Xiaolong [1 ,2 ]
Peng, Dongliang [3 ]
Hua, Nengbin [1 ,2 ]
Chen, Wenzhe [1 ,2 ]
机构
[1] School of Materials Science and Engineering, Fujian University of Technology, Fuzhou,350108, China
[2] Fujian Provincial Key Laboratory of Advanced Materials Processing and Application, Fuzhou,350108, China
[3] State Key Laboratory for Physical Chemistry of Solid Surfaces, Fujian Key Laboratory of Materials Genome, Collaborative Innovation Center of Chemistry for Energy Materials, College of Materials, Xiamen University, Xiamen,361005, China
关键词
Hot pressing - Tribology - Wear resistance - Erosion - Binary alloys - Silicon compounds - Nitrogen compounds - Sintering - Vickers hardness - Adhesives;
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摘要
In this study, WC doped W-Cu composites with high hardness and excellent tribological properties were prepared using hot pressing sintering with Cu coated W composite powders. Friction and wear behaviors of W-Cu-WC composites and W-Cu composites against Si3N4 balls at room and high temperatures (e.g., 25 ℃, 700 ℃ and 900 ℃) were investigated using a ball-on-disk high temperature tribometer in vacuum. Results showed that the Vickers hardness of WC doped W-Cu composites (245 HV) was relatively higher than that of the W-Cu composites. The specific wear rate of WC doped W-Cu composites was lower than that of the W-Cu composites in the temperature range of 25–900, and that at 700 °C (56.3 × 10−5 mm3/Nm) was an order of magnitude lower than that of the W-Cu composites. The wear resistance of W-Cu composites doped with WC particles was dramatically improved in vacuum. The dominant wear mechanisms of W-Cu composites were abrasive wear, adhesive wear and delamination at various temperatures, whereas the dominant wear mechanisms of W-Cu-WC composites were abrasive wear and delamination at various temperatures. Data availability statement: The data will be made available upon request. © 2021
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