State of the art in interconnect simulation

被引：0
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作者：
Sabelka, R. [1 ]
Harlander, C. [1 ]
Selberherr, S. [1 ]
机构：
[1] TU Vienna, Vienna, Austria
来源：
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD | 2000年
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页码：6 / 11
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