Characterisation of interfacial adhesion of thin film/substrate systems using indentation-induced delamination: A focused review

被引：10
作者：
Lu, Mingyuan [1 ]
Xie, Hongtao [1 ]
Huang, Han [1 ]
机构：
[1] School of Mechanical and Mining Engineering, University of Queensland, Brisbane
来源：
Key Engineering Materials | 2013年 / 533卷
关键词：
Acoustic emission; Adhesion; Bilayer; Delamination; Indentation; Thin film;
D O I：
10.4028/www.scientific.net/KEM.533.201
中图分类号：
学科分类号：
摘要：
This review summarized the research works on the characterisation of interfacial adhesion in thin film/substrate bilayer structure by use of indentation testing. It focused on the delamination mechanics between a thin film and a substrate induced by indentation and the quantitative characterisation of interfacial strength in such bilayer systems. Three major techniques were introduced, namely conventional indentation, cross-sectional indentation and acoustic emission assisted indentation. A number of theoretical models and finite element simulation studies were discussed, in association with the experimental investigations. ©(2013) Trans Tech Publications, Switzerland.
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页码：201 / 222
页数：21
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