共 24 条
- [1] Luo Y., Wang B., Liu B., Et al., Junction temperature variation mechanism and monitoring method of IGBTs based on derivative of voltage to current, High Voltage Engineering, 43, 1, pp. 38-43, (2017)
- [2] Qian Z., Zhang J., Sheng K., Status and development of power semiconductor devices and its applications, Proceedings of the CSEE, 34, 29, pp. 5149-5161, (2014)
- [3] Zheng C., Cai Z., Wang Y., Et al., Integrated driving circuit of IGBT series connected system, Journal of Zhejiang University: Engineering Science, 47, 12, pp. 2094-2100, (2013)
- [4] Byant A.T., Mawby P.A., Palmer P.R., Et al., Exploration of power device reliability using compact device models and fast electro-thermal simulation, IEEE Transactions on Industry Application, 44, 3, pp. 894-903, (2008)
- [5] Lu G., A study on the lifetime prediction technique for the IGBT power module, (2012)
- [6] Yao F., Wang S., Chen S., Et al., Research on transient thermal impedance measurement method of IGBT power module, Power Electronics, 50, 9, pp. 103-105, (2016)
- [7] Yang X., Zhou L., Du X., Et al., Review of isolated gate bipolar transistor's junction temperature measurement, Electrical Measurement & Instrumentation, 49, 2, pp. 7-12, (2012)
- [8] Chen M., Hu A., Liu B., Failure mechanism and lifetime prediction modeling of IGBT power electronic devices, Journal of Xi'an Jiaotong University, 45, 10, pp. 65-71, (2011)
- [9] Chen M., Hu A., Study on the junction temperature simulation and detection method of IGBT power electronic devices, Electric Machines and Control, 15, 12, (2011)
- [10] Liang Y., Technological development in evaluating the temperature and ampacity of power cables, High Voltage Engineering, 42, 4, pp. 1142-1150, (2016)