共 50 条
- [1] Analysis of Coupling Capacitance Between TSVs and Metal Interconnects in 3D-ICs 2012 19TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS (ICECS), 2012, : 745 - 748
- [2] Recovery of Faulty TSVs in 3D ICs PROCEEDINGS OF THE SIXTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2015), 2015, : 528 - 531
- [3] Modeling of Coupled TSVs in 3D ICs 2012 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2012, : 7 - 11
- [4] Fault Detection and Redundancy Design for TSVs in 3D ICs PROCEEDINGS OF 2015 IEEE 11TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2015,
- [5] TSVs in Early Layout Design Exploration for 3D ICs 2014 IEEE 5TH LATIN AMERICAN SYMPOSIUM ON CIRCUITS AND SYSTEMS (LASCAS), 2014,
- [6] THERMAL ANALYSIS OF 3D ICS WITH TSVS PLACEMENT OPTIMIZATION PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019, 2020,
- [7] Coupling computation of the BEM and FDM in 3D capacitance extraction 2001 4TH INTERNATIONAL CONFERENCE ON ASIC PROCEEDINGS, 2001, : 716 - 719
- [8] A Built-In Method for Measuring the Delay of TSVs in 3D ICs 2016 21TH IEEE EUROPEAN TEST SYMPOSIUM (ETS), 2016,
- [10] A Low Overhead Leakage Test Structure for TSVs of 3D ICs 2016 2ND INTERNATIONAL CONFERENCE ON INDUSTRIAL INFORMATICS - COMPUTING TECHNOLOGY, INTELLIGENT TECHNOLOGY, INDUSTRIAL INFORMATION INTEGRATION (ICIICII), 2016, : 166 - 169