Coupling capacitance extraction between TSVs in 3D ICs using inverse of inductance Matrix

被引:0
|
作者
Kobayashi, Tetsuya [1 ]
Niioka, Nanako [1 ]
Fukase, Masa-Aki [1 ]
Kurokawa, Atsushi [1 ]
机构
[1] Hirosaki University, 3, Bunkyocho, Hirosaki-shi, Aomori,036-8561, Japan
关键词
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I
10.1541/ieejeiss.135.744
中图分类号
学科分类号
摘要
Inductance - Inverse problems - Matrix algebra - Capacitance - Electronics packaging - Extraction - Timing circuits
引用
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页码:744 / 751
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