Monolithic integrated surface micromachined pressure sensors with analog on-chip linearization and temperature compensation

被引：0

作者：

Trieu, H.K. ^{[1
]}

Knier, M. ^{[1
]}

Koester, O. ^{[1
]}

Kappert, H. ^{[1
]}

Schmidt, M. ^{[1
]}

Mokwa, W. ^{[1
]}

机构：

[1] Fraunhofer Inst of Microelectronic, Circuits and Systems, Duisburg, Germany

来源：

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) | 2000年

关键词：

CMOS integrated circuits - Cost effectiveness - Micromachining - Microprocessor chips - Microsensors - Pressure transducers;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

This paper introduces a noval family of monolithic integrated surface micromachined pressure sensors with both linearization and temperature compensation done on-chip. All sensor parameters are fully programmable and on-chip stored using integrated EEPROM. Surface micromachined capacitive pressure sensors are predestinated for monolithic integrated sensor systems due to their compatibility to a standard CMOS process. This enables a cost effective production. Compared with piezoresistive pressure sensors, the surface micro-machined pressure sensors are superior with respect to high overpressure stability, simple packaging, ease of monolithic integration of signal conditioning electronics, low power consumption and small chip size.

引用

页码：547 / 550