A review on reliability of electronic packaging in micro/nano manufacturing

被引：0

作者：

Yang, Ping ^{[1
]}

Wang, Yang ^{[1
]}

Deng, Lin ^{[1
]}

机构：

[1] Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/OEDS, Jiangsu University, Zhenjiang

来源：

International Journal of Materials and Structural Integrity | 2015年 / 9卷 / 1-3期

基金：

中国国家自然科学基金;

关键词：

Dynamic; Electronic packaging; Fatigue test; FEM; Finite element method; Reliability; Thermal loading; Vibration;

D O I：

10.1504/IJMSI.2015.071114

中图分类号：

学科分类号：

摘要：

Electronic packaging is a critical part of products such as computers, smart phones, automotive components and other electronic devices. Along with the development of society and economy, the demand for electronic devices and its quality has increased rapidly in recent years. Thus, it is necessary to research the reliability of electronic packaging. This paper presents a review of recent investigations on the reliability of electronic packaging components. The dynamic characteristics and fatigue test under different loading conditions are discussed, including vibration loading, thermal loading and combined loading. Finite element method (FEM) is used frequently in the studies as well as experimental test. Finally, it is significant to emphasise the importance of electronic packaging. Copyright © 2015 Inderscience Enterprises Ltd.

引用

页码：131 / 143

页数：12

共 30 条

[1]

Basaran C., Cartwright A., Zhao Y., Experimental damage mechanics of microelectronics solder joints under concurrent vibration and thermal loading, International Journal of Damage Mechanics, 10, 2, pp. 153-170, (2001)

[2]

Chen Y.S., Wang C.S., Yang Y.J., Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components, Microelectronics Reliability, 48, 4, pp. 638-644, (2008)

[3]

Darveaux R., Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction, Journal of Electronic Packaging, 124, 3, pp. 147-154, (2002)

[4]

Eckert T., Kruger M., Muller W.H., Et al., Investigation of the solder joint fatigue life in combined vibration and thermal cycling tests, Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, IEEE, pp. 1209-1216, (2010)

[5]

Erinc M., Schreurs P.J.G., Geers M.G.D., Integrated numerical experimental analysis of interfacial fatigue fracture in SnAgCu solder joints, International Journal of Solids and Structures, 44, 17, pp. 5680-5694, (2007)

[6]

George E., Das D., Osterman M., Et al., Thermal cycling reliability of lead-free solders (SAC305 and Sn3.5Ag) for high-temperature applications, IEEE Transactions on Device and Materials Reliability, 11, 2, pp. 328-338, (2011)

[7]

Han C., Oh C.M., Hong W.S., Prognostics model development of BGA assembly under vibration environment, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2, 8, pp. 1329-1334, (2012)

[8]

Kim Y., Noguchi H., Amagai M., Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder, Microelectronics Reliability, 46, 2, pp. 459-466, (2006)

[9]

Lall P., Islam N., Evans J., Suhling J., Reliability of BGA and CSP on metal backed printed circuit boards in harsh environments, Journal of Electronic Packaging, 129, 4, pp. 382-390, (2007)

[10]

Lall P., Limaye G., Suhling J., Murtuza M., Palmer B., Cooper W., Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration, 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, pp. 753-761, (2012)

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