One-Dimensional Constrained Blister Test to Measure Thin Film Adhesion

被引：7

作者：

Zhu, Tingting ^{[1
]}

Muftu, Sinan ^{[1
]}

Wan, Kai-tak ^{[1
]}

机构：

[1] Northeastern Univ, Mech & Ind Engn, Boston, MA 02115 USA

来源：

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 2018年 / 85卷 / 05期

基金：

美国国家科学基金会;

关键词：

thin film; adhesion; delamination; constrained blister; pull-off;

D O I：

10.1115/1.4039171

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

A rectangular film is clamped at the opposite ends before being inflated into a blister by an external pressure, p. The bulging film adheres to a constraining plate with distance, w(0), above. Increasing pressure expands the contact area of length, 2c. Depressurization shrinks the contact area and ultimate detaches the film. The relation of (p, w(0), c) is established for a fixed interfacial adhesion energy.

引用

页数：3