Recovery stress generation in shape memory Ti50Ni45Cu5 thin wires

被引：72

作者：

Sittner, P. ^{[1
]}

Vokoun, D. ^{[1
]}

Dayananda, G.N. ^{[1
]}

Stalmans, R. ^{[1
]}

机构：

[1] Institute of Physics, Acad. Sci. Czech Rep., Na S., Prague

[2] Dept. of Metall. and Mat. Eng., Kathol. Univ. Leuven, Croylaan 2, B., Heverlee

来源：

Materials Science and Engineering A | 2000年 / 286卷 / 02期

关键词：

Hysteresis modelling; Martensitic transformation; Recovery stress; Shape memory alloy;

D O I：

10.1016/S0921-5093(00)00816-9

中图分类号：

学科分类号：

摘要：

The recovery stresses evolving in constrained Ti50Ni45Cu5 (at.%) shape memory wires were investigated in thermomechanical experiments performed in combination with electric resistance measurements. The hysteretic stress-temperature responses of the wires in constrained thermal cycles were analyzed by comparing the experimental results with simulated responses using a phenomenological algorithm developed for prediction of uniaxial thermomechanical SMA behaviors. The effects of individual SMA material parameters, constraint parameters, test boundary conditions and thermomechanical history on the evolution of recovery stresses in SMA wires are predicted. © 2000 Elsevier Science S.A.

引用

页码：298 / 311

页数：13

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