Message from the Technical Program Chair and Co-Chairs

被引：0

作者：

Che, Wenquan ^{[1
]}

Mansour, Raafat ^{[2
]}

Zhang, Xiu Yin ^{[1
]}

Gong, Songbin ^{[3
]}

Li, Yuanxin ^{[4
]}

Yang, Wanchen ^{[1
]}

Zhu, Haoshen ^{[1
]}

机构：

[1] South China University of Technology, China

[2] University of Waterloo, Canada

[3] University of Illinois at Urbana-Champaign, United States

[4] Sun Yat-sen University, China

来源：

IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings | 2022年

关键词：

D O I：

10.1109/IMWS-AMP54652.2022.10106805

中图分类号：

学科分类号：

摘要：

引用