Texture of electroplated copper film under biaxial stress

被引：0
|
作者：
Hong, Bo [1 ]
Jiang, Chuan-Hai [1 ]
Wang, Xin-Jian [1 ]
机构：
[1] School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
来源：
Mater. Trans. | / 9卷 / 2299-2301期
关键词：
Compendex;
D O I：
暂无
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学科分类号：
摘要：
Anisotropy - Copper plating - Crystal orientation - Electroplating - Tensile stress - Textures - X ray diffraction analysis
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