Future material systems: Requirements and applications

被引：0
|
作者：
Kasper, Erich [1 ]
Müssig, Hans-Joachim [2 ]
Grimmeiss, Hermann G. [3 ]
机构：
[1] Universitaet Stuttgart, Institut fuer Halbleitertechnik, Stuttgart, Germany
[2] IHP, Im Technologiepark 25, D-15236 Frankfurt (Oder), Germany
[3] University of Lund, Department of Solid State Physics, Box 118, S-22100 Lund, Sweden
来源：
Materials Science Forum | 2009年 / 608卷
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
System-on-chip
引用
收藏
页码：17 / 26
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