Fully packaged finite-ground coplanar line-to-micromachined waveguide transition

被引：0
|
作者：
Becker, James P. [1 ]
Lee, Yongshik [1 ]
East, Jack R. [1 ]
Katehi, Linda P.B. [1 ]
机构：
[1] Univ of Michigan, Ann Arbor, United States
来源：
IEEE Topical Meeting on Electrical Performance of Electronic Packaging | 2000年
关键词：
Computer simulation - Micromachining - Silicon;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：273 / 276
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