Application of a force sensor in wire bonding process

被引：0

作者：

Zhou, Lei ^{[1
]}

Li, Jiangang ^{[1
]}

Fu, Lanhui ^{[1
]}

Li, Zexiang ^{[2
]}

机构：

[1] Department of Control and Mechatronics Engineering, Shenzhen Graduate School Harbin Institute of Technology, Shenzhen, 518055, China

[2] Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong, 999077, China

来源：

Sensors and Transducers | 2013年 / 159卷 / 11期

关键词：

Wire - Force control;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：345 / 350