Practical EBG application to multilayer PCB: Impact on signal integrity

被引：4
作者：
Nisanci, M.H. [1 ]
De Paulis, F. [1 ]
Di Febo, Danilo [1 ]
Orlandi, A. [1 ]
机构：
[1] UAq EMC Laboratory, Department of Industrial and Information Engineering, Economics, University of l'Aquila, L'Aquila
来源：
IEEE Electromagnetic Compatibility Magazine | 2013年 / 2卷 / 02期
关键词：
Electromagnetic band gap structures; Printed circuit boards; Signal integrity;
D O I：
10.1109/MEMC.2013.6650084
中图分类号：
学科分类号：
摘要：
In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn. © 2013 IEEE Electromagnetic Compatibility Magazine.
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收藏
页码：82 / 87
页数：5
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