Effect of oxygen radical in hydrophilization treatment of polyimide using ar-o2 mixture gas surface wave plasma

被引:0
作者
Hirukawa, Yoshinari [1 ]
Ono, Shigeru [1 ]
机构
[1] Tokyo City University 1-28-1, Tamatsutsumi
来源
| 1600年 / Institute of Electrical Engineers of Japan卷 / 134期
基金
日本学术振兴会;
关键词
Electron density; Electron temperature; Oxygen radical density; Polyimide; Surface modification; Surface wave plasma;
D O I
10.1541/ieejfms.134.91
中图分类号
学科分类号
摘要
Hydrophilic treatment of polyimide has been investigated using Ar-O2 mixture gas surface wave plasma apparatus. As results, sufficient hydrophilic treatment has been observed in the position well away from a dielectric plate for surface wave plasma generation. Spatial distribution of electron temperature and electron density showed the rapid decrease with increasing distance from the dielectric plate. However, catalytic probe measurement of atomic oxygen radical density showed the high oxygen radical density in the position well away from the dielectric plate. Hydrophilic treatment experiment was conducted at different two positions by adjusting treatment time to accomplish same oxygen radical amount reaching. Water contact angle of these two treated sample showed good agreement. Important contribution of the atomic oxygen radical in the downstream region of surface wave plasma had been shown through the hydrophilic processing experiment of polyimide. © 2014 The Institute of Electrical Engineers of Japan.
引用
收藏
页码:91 / 97+4
相关论文
共 17 条
[1]  
Lai J., Sunderland B., Xue J., Yan S., Zhao W., Folkard M., Michael B.D., Wang Y., Study on hydrophilicity of polymer surfacesimproved by plasma treatment, Appl. Surf. Sci., 252, 10, pp. 3375-3379, (2006)
[2]  
Uemura A., Tanabe T., Iwamori S., Effect of sputtering condition on thin films deposited by R.F. Sputtering with a polyimide target, IEEJ Trans. FM, 130, 2, pp. 147-154, (2010)
[3]  
Ogasawara S., Base materials and surface finishing technology, metal- polyimide substrate, J. Surf. Finishing Soc. Jpn, 46, 3, pp. 210-214, (1995)
[4]  
Toyoshima R., Matsuda F., Development of fpc technologies for high density wirings and high speed signals, Trans. Jpn Inst. Electron. Packaging, 7, 5, pp. 447-451, (2004)
[5]  
Ikari S., Ishida S., Matsuoka T., Hirayama T., Kato K., Effect of oxygen plasma treatment on adhesionn of copper plating film to polyimide film for flexible printed circuits, J. Soc. Mater. Sci. Jpn, 59, 9, pp. 705-711, (2010)
[6]  
Cheng C., Liye Z., Zhan R.-J., Surface modification of polymer fibre by the new atmospheric pressure cold plasma jet, Surf. & Coat. Technol., 200, 24, pp. 6659-6665, (2006)
[7]  
Yokota K., Seikyu S., Tagawa M., Ohmae N., A quantitative styudy in synergistic effects of atomic oxygen and ultraviolet regarding polymer erosion in leo space environment, Proc. Of the 9th International Symposium on Materials in a Space Environment, pp. 265-272, (2003)
[8]  
Ono S., Yamada M., The effect of radicals on the surface treatment using atmospheric pressure microwave plasma, IEEJ Trans. FM, 130, 10, pp. 919-924, (2010)
[9]  
Yuasa M., Application of mass production for electric devices using atmospheric pressure plasma, J. Surf. Finishing Soc. Jpn, 60, 6, pp. 390-394, (2009)
[10]  
Sugai H., Electron energy distribution function and radical composition, J. Plasma & Fusion Res., 77, 7, pp. 660-665, (2001)