Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

被引：0

作者：

Nihon Superior Centre for the Manufacture of Electronic Materials , School of Mechanical and Mining Engineering, University of Queensland, Brisbane ^{[1
]}

QLD

4072, Australia

不详 ^{[2
]}

02600, Malaysia

不详 ^{[3
]}

564-0063, Japan

机构：

来源：

Int. Conf. Electron. Pack., ICEP | 2017年 / 377-380期

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摘要：

Cu substrate - Eutectic microstructure - IMC layer - Lead-free solder alloy - Ni additions - SAC-solders - Solder balls - Solid solution strengthening

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