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More metal parts go to composites
被引：0
作者：
Hoffman, Jean M.
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关键词：
Ceramic materials - End effectors - Fiber reinforced materials - Injection molding - Laminated composites - Machine design - Semiconductor device manufacture - Wear resistance;
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摘要：
An account of the increasing use of composite materials in semiconductor applications traditionally handled by metal and ceramics, is presented. The Vespel composites, which are fiber reinforced polymers with good strength-to-weight ratio, are replacing metals, ceramics and other thermoplastics in wafer processing and handling application. The use of a ultraclean Vespel CP-9800 composite, made from an ultrahigh-modulus carbon-fiber and epoxy laminate, to make robotic end effectors is also discussed.
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页码：50 / 52
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