共 50 条
- [21] Novel Cross-point Resistive Switching Memory with Self-formed Schottky Barrier 2010 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2010, : 53 - 54
- [22] Improving the Integrity of Ti Barrier Layer in Cu-TSVs Through Self-Formed TiSix for Via-Last TSV Technology 2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2016,
- [23] Ti-based quasicrystal layers produced by plasma thermal spraying PROGRESS IN POWDER METALLURGY, PTS 1 AND 2, 2007, 534-536 : 449 - +
- [24] High-throughput computational screening of Ti-based binary alloys as diffusion barrier layers for copper interconnects MATERIALS TODAY COMMUNICATIONS, 2023, 36
- [28] Growth behavior of self-formed barrier using Cu-Mn alloys at 350 to 600 °C PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2006, : 155 - +
- [30] Fabrication, structure and properties of Ti-based HTS thin films NANO-CRYSTALLINE AND THIN FILM MAGNETIC OXIDES, 1999, 72 : 209 - 220