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- [2] Oxygen-induced barrier failure in Ti-based self-formed and Ta/TaN barriers for Cu interconnects Jpn. J. Appl. Phys., 4 PART 2
- [4] Self-Formed Ti-Rich Barrier Layers in Cu(Ti)/Low-k Samples STRESS-INDUCED PHENOMENA IN METALLIZATION, 2009, 1143 : 118 - +
- [7] Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films Journal of Electronic Materials, 2010, 39 : 1326 - 1333
- [8] Application Of Ti-Based Self-Formation Barrier Layers To Cu Dual-Damascene Interconnects STRESS-INDUCED PHENOMENA IN METALLIZATION, 2010, 1300 : 91 - +
- [9] Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples Journal of Electronic Materials, 2008, 37 : 1148 - 1157