Furnace RTP platform hots up

被引：0

作者：

Larner, David ^{[1
]}

Osborne, Nick ^{[1
]}

Rust, Werner ^{[1
]}

Laser, Allan ^{[1
]}

机构：

[1] Silicon Valley Group

来源：

European Semiconductor | 2000年 / 22卷 / 07期

关键词：

Annealing - Electric furnaces - Ion implantation - Optimization - Process control - Rapid thermal annealing - Silicon wafers;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Single wafer furnaces provide good thermal uniformity, but there are problems in terms of throughput. It is shown how rapid thermal processing (RTP) furnace can overcome these problems. The benefits in incorporating furnace capabilities with the advantages of single-wafer processing are discussed.

引用

页码：27 / 28