Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)

被引:0
作者
Lee, Sung-Gwang [1 ]
Bae, Juhan [1 ]
Choi, Hoomi [2 ]
Jeong, Jaein [2 ]
Kim, Youngjeong [2 ]
Hwang, Wontae [1 ]
机构
[1] Seoul Natl Univ, Dept Mech Engn, Seoul 08826, South Korea
[2] Samsung Elect Co Ltd, Memory Div, Suwon 18448, Gyeonggi, South Korea
关键词
FOUP; EFEM; LPP; humidity; MRV; CFD; HUMIDITY;
D O I
10.1109/TSM.2024.3473868
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The front opening unified pod (FOUP) is a carrier that transports multiple wafers as it moves between numerous processing facilities. It is inevitably exposed to air humidity coming from the equipment front end module (EFEM), which leads to the formation of harmful residual particles on the wafer surfaces due to the reaction of moisture with airborne molecular contamination (AMC). This can cause serious defects, and thus there is a need to understand the complex flow structure inside the EFEM and FOUP. Magnetic resonance velocimetry (MRV) is hereby employed to qualitatively and quantitatively measure the 3D flow when conventional load port purge (LPP) is utilized to protect the wafers. The front LPP forms a barrier between the FOUP and EFEM, blocking the EFEM flow from entering the FOUP. Additionally, at the rear of the FOUP, flow from the rear and front LPP collide and then travels between the wafers toward the FOUP entrance, thereby protecting the wafers. Using computational fluid dynamic (CFD) simulations, various combinations of flow rates from different purge ports were simulated, leading to an optimal flow condition. These findings suggest that independent control of the flow rates can be a practical way to protect the wafers from defects.
引用
收藏
页码:620 / 628
页数:9
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