Component optimization of polishing slurry on chemical mechanical planarization of cobalt contact

被引:0
|
作者
Tian, Qi-Yuan [1 ]
Wang, Sheng-Li [1 ]
Xiao, Yue [1 ]
Wang, Chen-Wei [1 ]
Liu, Feng-Xia [1 ]
Liang, Ting-Wei [1 ]
机构
[1] School of Electronic Information Engineering, Hebei University of Technology, Tianjin,300130, China
来源
Surface Technology | 2018年 / 47卷 / 09期
关键词
D O I
10.16490/j.cnki.issn.1001-3660.2018.09.036
中图分类号
学科分类号
摘要
引用
收藏
页码:272 / 278
相关论文
共 50 条
  • [41] Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization
    Bahr, Matthew
    Sampurno, Yasa
    Han, Ruochen
    Philipossian, Ara
    MICROMACHINES, 2017, 8 (06)
  • [42] Study on the Slurry for Chemical Mechanical Polishing of GaN Wafer
    Liu, Yang
    Zhang, Baoguo
    Qin, Sihui
    Wang, Yijun
    Xian, Wenhao
    Liu, Min
    Cui, Dexing
    CONFERENCE OF SCIENCE & TECHNOLOGY FOR INTEGRATED CIRCUITS, 2024 CSTIC, 2024,
  • [43] Tribological analysis on powder slurry in chemical mechanical polishing
    Jeng, YR
    Tsai, HJ
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2002, 35 (13) : 1585 - 1591
  • [44] Formulation of slurry for chemical mechanical polishing of Cu substrates
    Hazarika, Jenasree
    Patil, Chetana Sudhakar
    Rajaraman, Prasanna Venkatesh
    MATERIALS TODAY-PROCEEDINGS, 2021, 39 : 1781 - 1785
  • [45] Research progress of green chemical mechanical polishing slurry
    Gao Pei-Li
    Zhang Zhen-Yu
    Wang Dong
    Zhang Le-Zhen
    Xu Guang-Hong
    Meng Fan-Ninq
    Xie Wen-Xiang
    Bi Sheng
    ACTA PHYSICA SINICA, 2021, 70 (06)
  • [46] Research progress of green chemical mechanical polishing slurry
    Gao, Pei-Li
    Zhang, Zhen-Yu
    Wang, Dong
    Zhang, Le-Zhen
    Xu, Guang-Hong
    Meng, Fan-Ning
    Xie, Wen-Xiang
    Bi, Sheng
    Wuli Xuebao/Acta Physica Sinica, 2021, 70 (06):
  • [47] Chemical mechanical polishing of copper using silica slurry
    Kondo, S
    Sakuma, N
    Homma, Y
    Ohashi, N
    PROCEEDINGS OF THE SYMPOSIA ON ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION I AND INTERCONNECT AND CONTACT METALLIZATION: MATERIALS, PROCESSES, AND RELIABILITY, 1999, 98 (06): : 195 - 205
  • [48] Hydrodynamics of slurry flow in chemical mechanical polishing - A review
    Terrell, EJ
    Higgs, CF
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (06) : K15 - K22
  • [49] Characterization and optimization of copper chemical mechanical planarization
    Laursen, T
    Grief, M
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (10) : 1059 - 1065
  • [50] Characterization and optimization of copper chemical mechanical planarization
    Thomas Laursen
    Malcolm Grief
    Journal of Electronic Materials, 2002, 31 : 1059 - 1065