Component optimization of polishing slurry on chemical mechanical planarization of cobalt contact

被引:0
|
作者
Tian, Qi-Yuan [1 ]
Wang, Sheng-Li [1 ]
Xiao, Yue [1 ]
Wang, Chen-Wei [1 ]
Liu, Feng-Xia [1 ]
Liang, Ting-Wei [1 ]
机构
[1] School of Electronic Information Engineering, Hebei University of Technology, Tianjin,300130, China
来源
Surface Technology | 2018年 / 47卷 / 09期
关键词
D O I
10.16490/j.cnki.issn.1001-3660.2018.09.036
中图分类号
学科分类号
摘要
引用
收藏
页码:272 / 278
相关论文
共 50 条
  • [31] Thin layer growth on cobalt surface in solutions simulating slurry chemistry for chemical mechanical polishing
    Kondoh, Eiichi
    Takeuchi, Shota
    Jin, Lianhua
    Koshino, Ryota
    Hamada, Satomi
    Hiyama, Hirokuni
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2022, 61 (SJ)
  • [32] Influence of slurry components on uniformity in copper chemical mechanical planarization
    Lee, Hyunseop
    Park, Boumyoung
    Jeong, Haedo
    MICROELECTRONIC ENGINEERING, 2008, 85 (04) : 689 - 696
  • [33] Alkaline barrier slurry applied in TSV chemical mechanical planarization
    Ma Suohui
    Wang Shengli
    Liu Yuling
    Wang Chenwei
    Yang Yan
    JOURNAL OF SEMICONDUCTORS, 2014, 35 (02)
  • [34] AMMONIUM-SALT-ADDED SILICA SLURRY FOR THE CHEMICAL-MECHANICAL POLISHING OF THE INTERLAYER DIELECTRIC FILM PLANARIZATION IN ULSIS
    HAYASHI, Y
    SAKURAI, M
    NAKAJIMA, T
    HAYASHI, K
    SASAKI, S
    CHIKAKI, S
    KUNIO, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (2B): : 1037 - 1042
  • [35] Applications of a laser assisted defect detection system for chemical mechanical planarization (CMP) slurry development in rigid disk polishing
    Kasai, Toshi
    Dowell, Charles
    Somanchi, Anoop
    MEASUREMENT SCIENCE AND TECHNOLOGY, 2007, 18 (05) : 1582 - 1590
  • [36] Alkaline barrier slurry applied in TSV chemical mechanical planarization
    马锁辉
    王胜利
    刘玉岭
    王辰伟
    杨琰
    Journal of Semiconductors, 2014, 35 (02) : 141 - 144
  • [37] Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization
    Meled, Anand
    Zhuang, Yun
    Sampurno, Yasa Adi
    Theng, Siannie
    Jiao, Yubo
    Borucki, Leonard
    Philipossian, Ara
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (05)
  • [38] An investigation of slurry chemistry used in chemical mechanical planarization of aluminum
    Kallingal, CG
    Duquette, DJ
    Murarka, SP
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (06) : 2074 - 2081
  • [39] Optimization of Slurry and Technological Parameter on Chemical Mechanical Polishing of Titanium Dioxide Film for IC
    Jun, Ren
    Zhang Kailiang
    Fang, Wang
    Zhang Taofeng
    Yuan, Yujie
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 519 - 524
  • [40] Analysis of the Polishing Slurry Flow of Chemical Mechanical Polishing by Polishing Pad with Phyllotactic Pattern
    Lv Yushan
    Zhang Tian
    Wang Jun
    Li Nan
    Duan Min
    Xing Xue-Ling
    FOURTH INTERNATIONAL SEMINAR ON MODERN CUTTING AND MEASUREMENT ENGINEERING, 2011, 7997