共 50 条
- [34] AMMONIUM-SALT-ADDED SILICA SLURRY FOR THE CHEMICAL-MECHANICAL POLISHING OF THE INTERLAYER DIELECTRIC FILM PLANARIZATION IN ULSIS JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (2B): : 1037 - 1042
- [39] Optimization of Slurry and Technological Parameter on Chemical Mechanical Polishing of Titanium Dioxide Film for IC CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 519 - 524
- [40] Analysis of the Polishing Slurry Flow of Chemical Mechanical Polishing by Polishing Pad with Phyllotactic Pattern FOURTH INTERNATIONAL SEMINAR ON MODERN CUTTING AND MEASUREMENT ENGINEERING, 2011, 7997