Component optimization of polishing slurry on chemical mechanical planarization of cobalt contact

被引：0
|
作者：
Tian, Qi-Yuan [1 ]
Wang, Sheng-Li [1 ]
Xiao, Yue [1 ]
Wang, Chen-Wei [1 ]
Liu, Feng-Xia [1 ]
Liang, Ting-Wei [1 ]
机构：
[1] School of Electronic Information Engineering, Hebei University of Technology, Tianjin,300130, China
来源：
Surface Technology | 2018年 / 47卷 / 09期
关键词：
D O I：
10.16490/j.cnki.issn.1001-3660.2018.09.036
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：272 / 278
相关论文
共 50 条
  • [21] Evaluation and Mechanism Study of a Novel Green Chemical Mechanical Polishing Slurry for Cobalt Interconnects
    Huang, Zisheng
    Chang, Pengfei
    Zhou, Xiangzhuo
    Hang, Tao
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [22] Cobalt "Buff Step" Chemical Mechanical Planarization
    Stuffle, Calliandra
    Han, Ruochen
    Sampurno, Yasa
    Theng, Siannie
    Tseng, Wei-Tsu
    Philipossian, Ara
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2018, 7 (03) : P114 - P117
  • [23] A new chemical mechanical planarization with the frozen chemical etchant as a polishing pad
    Kim, YW
    Yoo, JO
    Jung, TW
    Oh, YJ
    Chung, CH
    2001 INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, PROCEEDINGS, 2001, : 30 - 33
  • [24] Slurry transport during chemical mechanical polishing
    Fu, Ming-Nan
    Liao, Shan-Hui
    Li, Ching-Chung
    Chang, Pai-Yu
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2005, 44 (11): : 7843 - 7848
  • [25] Research progress of chemical mechanical polishing slurry
    Meng, Fan-Ning
    Zhang, Zhen-Yu
    Gao, Pei-Li
    Meng, Xiang-Dong
    Liu, Jian
    Surface Technology, 2019, 48 (07):
  • [26] Slurry transport during chemical mechanical polishing
    Fu, MN
    Liao, SH
    Li, CC
    Chang, PY
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (11): : 7843 - 7848
  • [27] Physical and chemical characterization of reused oxide chemical mechanical planarization slurry
    Kim, HJ
    Eom, DH
    Park, JG
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2001, 40 (3A): : 1236 - 1239
  • [28] Wafer scale variation of planarization length in chemical mechanical polishing
    Oji, C
    Lee, B
    Ouma, D
    Smith, T
    Yoon, J
    Chung, J
    Boning, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (11) : 4307 - 4312
  • [29] CHEMICAL-MECHANICAL WAFER POLISHING AND PLANARIZATION IN BATCH SYSTEMS
    KOLENKOW, R
    NAGAHARA, R
    SOLID STATE TECHNOLOGY, 1992, 35 (06) : 112 - 114
  • [30] Effect of novel green inhibitor on corrosion and chemical mechanical polishing properties of cobalt in alkaline slurry
    Li, Haoran
    Zhang, Baoguo
    Li, Ye
    Wu, Pengfei
    Wang, Ye
    Xie, Mengchen
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2022, 146
12345