Finite element simulation of the micromachining of nanosized-silicon-carbide-particle reinforced composite materials based on the cohesive zone model

被引:10
作者
Pen H. [1 ]
Guo J. [2 ]
Cao Z. [1 ]
Wang X. [1 ]
Wang Z. [3 ]
机构
[1] Tianjin Institute of Aerospace Mechanical and Electrical Equipment, Tianjin
[2] Tianjin Long March Technical Equipment Co. Ltd, Tianjin
[3] Guilin University of Aerospace Technology, Guilin
基金
中国国家自然科学基金;
关键词
Cohesive zone model; Composite materials; Micromachining; Multiscale; Nanosized silicon carbide particles;
D O I
10.1016/j.npe.2018.12.003
中图分类号
学科分类号
摘要
A finite element method based on the cohesive zone model was used to study the micromachining process of nanosized silicon-carbide-particle (SiCp) reinforced aluminum matrix composites. As a hierarchical multiscale simulation method, the parameters for the cohesive zone model were obtained from the stress-displacement curves of the molecular dynamics simulation. The model considers the random properties of the siliconcarbide-particle distribution and the interface of bonding between the silicon carbide particles and the matrix. The machining mechanics was analyzed according to the chip morphology, stress distribution, cutting temperature, and cutting force. The simulation results revealed that the random distribution of nanosized SiCp causes non-uniform interaction between the tool and the reinforcement particles. This deformation mechanics leads to inhomogeneous stress distribution and irregular cutting force variation. © 2018, Editorial Office of Nanotechnology and Precision Engineering. All right reserved.
引用
收藏
页码:242 / 247
页数:5
相关论文
共 24 条
[1]  
Mazahery A., Abdizadeh H., Baharvandi H.R., Development of high-performance A356/nano-Al2O3 composites, Mater Sci Eng A, 518, pp. 61-64, (2009)
[2]  
Nie X., Research on semi-solid thixoforming of 7075 aluminum alloy composites reinforced with nano-sized SiC particles, (2015)
[3]  
Fang F.Z., Wu H., Liu Y.C., Modelling and experimental investigation on nanometric cutting of monocrystalline silicon, Int J Mach Tools Manuf, 45, 15, pp. 1681-1686, (2005)
[4]  
Kim Y.S., Na K.H., Choi S.O., Et al., Atomic force microscopy-based nano-lithography for nano-patterning: a molecular dynamic study, J Mater Process Technol, 155-156, pp. 1847-1854, (2004)
[5]  
Liang Y.C., Chen J.X., Bai Q.S., Et al., Molecular dynamics simulation of nanomachining process and mechanical properties of nanostructure, Acta Metall Sin, 44, 8, pp. 937-942, (2008)
[6]  
Lin B., Han X.S., Yu S.Y., Et al., Experimental study on molecular dynamics simulation in nanometer grinding, J Tianjin Univ (Sci Technol), 33, 5, pp. 652-656, (2000)
[7]  
Ye Y.Y., Biswas R., Morris J.R., Et al., Molecular dynamics simulation of nanoscale machining of copper, Nanotechnology, 14, 3, pp. 390-396, (2003)
[8]  
Goel S., Luo X., Reuben R.L., Wear mechanism of diamond tools against single crystal silicon in single point diamond turning process, Tribol Int, 57, 57, pp. 272-281, (2013)
[9]  
Jin Z.J., Xie F., Guo X.G., Et al., Wear mechanism of single crystal diamond tool against mold steel by molecular dynamics simulation, Nanotechnol Precis Eng, 14, 6, pp. 410-415, (2016)
[10]  
Pen H.M., Bai Q.S., Liang Y.C., Et al., Multiscale simulation of nanometric cutting of single crystal coppe-effect of different cutting speeds, Acta Metall Sin (Engl Lett), 22, 6, pp. 440-446, (2009)