Guest Editorial for Special Issue on Papers From 2023 IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS)

被引：0
|
作者：
Ng, Tse Nga [1 ]
Mantysalo, Matti [2 ]
Agarwala, Shweta [3 ]
Tee, Benjamin [4 ]
Kim, Woo Soo [5 ]
Grau, Gerd [6 ]
机构：
[1] University of California at San Diego, Department of Electrical and Computer Engineering, La Jolla, CA,92093, United States
[2] Tampere University, Department of Electrical Engineering, Tampere, Finland
[3] Aarhus University, Department of Electrical and Computer Engineering, Aarhus, Denmark
[4] National University of Singapore, Department of Materials Science and Engineering, Lower Kent Ridge Road, 119077, Singapore
[5] Simon Fraser University, Department of Mechatronic Systems Engineering, Burnaby,BC,V5A 1S6, Canada
[6] York University, Department of Electrical Engineering and Computer Science, Toronto,ON,M3J 1P3, Canada
来源：
IEEE Journal on Flexible Electronics | 2024年 / 3卷 / 05期
关键词：
D O I：
10.1109/JFLEX.2024.3426128
中图分类号：
学科分类号：
摘要：
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