Development Status and Perspective Trend of Ultra-thin Micro Heat Pipe

被引：10
|
作者：
Tang Y. [1 ,2 ]
Tang H. [1 ,2 ]
Wan Z. [1 ,2 ]
Yuan W. [1 ,2 ]
Lu L. [1 ,2 ]
Li Z. [1 ,2 ]
机构：
[1] School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou
[2] Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, Guangzhou
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2017年 / 53卷 / 20期
关键词：
Heat dissipation; Ultra-thin micro heat pipe; Wick structure;
D O I：
10.3901/JME.2017.20.131
中图分类号：
学科分类号：
摘要：
The rapid increase of heat generation level has become a major technical challenge in the development and applications of contemporary advanced microelectronic chip system. As an efficient heat transfer device, micro heat pipes have been widely used for thermal management of electronic devices because of their excellent thermal performance and high reliability. However, with electronic devices becoming highly integrated, lighter, and thinner, traditional micro heat pipes cannot meet the usage requirement. An ultra-thin micro heat pipe has been proposed and has become the research focus of modern heat pipe technology. The types and applications of ultra-thin micro heat pipe are introduced, as well as the research progresses of wick structure and forming process of ultra-thin micro heat pipe are summarized. Furthermore, the problems existed on ultra-thin micro heat pipe technology are pointed out and it is also suggested that more efforts should be made to what in the future. © 2017 Journal of Mechanical Engineering.
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页码：131 / 144
页数：13
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