Effects of tin and copper nanotexturization on tin whisker formation

被引：0

作者：

Lee, David M. ^{[1
]}

Piñol, Lesly A. ^{[1
]}

机构：

[1] Johns Hopkins Applied Physics Laboratory, United States

来源：

SMT Surface Mount Technology Magazine | 2012年 / 27卷 / 08期

关键词：

Tin;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

New research from authors at the Applied Physics Laboratory at Johns Hopkins in Laurel, Maryland, examines the effect of adding grain refiners during tin electroplating. Particular focus is given to as-deposited film morphology and the associated incidence of whiskering.

引用

页码：18 / 30