共 7 条
[1]
Henmi H., Et al., Vacuum packaging for microsensors by glass-silicon anodic bonding, Sens. Actuators A, 43, pp. 243-248, (1994)
[2]
Itoh T., Et al., 2D asymmetric silicon micro-mirrors for electrostatic field distribution measurement using optical level method, IEEJ Transactions on Sensors and Micromachines, 135, 8, pp. 311-316, (2015)
[3]
Wallis G., Pomerantz D.I., Field assisted glass-metal sealing, J. Appl. Phys., 40, pp. 3946-3949, (1969)
[4]
Schmidt M.A., Wafer-to-wafer bonding for microstructure formation, Proceedings of the IEEE, 86, 8, pp. 1575-1578, (1998)
[5]
Huff M.A., Nikolich A.D., Schmidt M.A., Design of sealed cavity microstructures formed by silicon wafer bonding, IEEE J. Microelectromech. Syst., 2, pp. 74-81, (1993)
[6]
Okada H., Et al., Effect of glass materials on joints in anodic bonding of glass to silicon, J. Japan Inst. Metals, 73, 2, pp. 110-115, (2009)
[7]
Sugiyama M., Developments in steel characterization techniques, Nippon Steel Technical Report, 69, pp. 1-6, (1996)