Physical design for 3D system on package

被引：48
|
作者：
Lim, Sung Kyu [1 ]
机构：
[1] School of Electrical and Computer Engineering, Georgia Institute of Technology, 777 Atlantic Dr. NW, Atlanta, GA 30332-0250, United States
来源：
IEEE Design and Test of Computers | 2005年 / 22卷 / 06期
关键词：
Chip-to-package interface - Electrical interconnect - Physical design algorithms - Three dimensional system on package;
D O I：
10.1109/MDT.2005.149
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：532 / 539
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