Process Optimization of Electroless Copper Plating on Alumina Ceramics Substrate

被引：0
|
作者：
机构：
[1] Zheng, Qiang
[2] Cai, Wei
[3] Chen, Fei
[4] Zhou, Jie
[5] Lan, Wei
[6] Fu, Chun-Lin
来源：
Cai, Wei | 1600年 / Chongqing Wujiu Periodicals Press卷 / 46期
关键词：
531.1 Metallurgy - 804.1 Organic Compounds - 804.2 Inorganic Compounds - 812.1 Ceramics - 921.5 Optimization Techniques - 931.2 Physical Properties of Gases; Liquids and Solids - 933.1 Crystalline Solids - 943.2 Mechanical Variables Measurements - 951 Materials Science;
D O I：
10.16490/j.cnki.issn.1001-3660.2017.04.034
中图分类号：
学科分类号：
摘要：
15
引用
收藏
相关论文
共 50 条
  • [31] COPPER MIRROR - ELECTROLESS PLATING OF COPPER
    HILL, JW
    FOSS, DL
    SCOTT, LW
    JOURNAL OF CHEMICAL EDUCATION, 1979, 56 (11) : 752 - 752
  • [32] AN AUGER SPECTROSCOPIC STUDY OF THE CATALYSIS PROCESS FOR ELECTROLESS COPPER PLATING
    GRUNWALD, JJ
    GOTTESFELD, S
    LASER, D
    PLATING AND SURFACE FINISHING, 1981, 68 (10): : 71 - 74
  • [33] THE SURFACE-LAYER PH IN THE ELECTROLESS COPPER PLATING PROCESS
    VASKELIS, A
    JAGMINIENE, A
    SURFACE & COATINGS TECHNOLOGY, 1987, 31 (01): : 45 - 54
  • [34] Laser irradiation induced copper layer growth on alumina ceramic by electroless plating
    Lu, Ze-Long
    Luo, Lai-Ma
    Huang, Xin-Min
    Chen, Jing-Bo
    Cheng, Ji-Gui
    Zhu, Liu
    Wu, Yu-Cheng
    Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2014, 35 (10): : 184 - 188
  • [35] MONOLAYER MOLECULAR ADSORPTION MODEL FOR ELECTROLESS COPPER PLATING PROCESS
    SHIGEMATSU, K
    KONDO, K
    HAYAKAWA, K
    IRIE, M
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (04) : 1149 - 1152
  • [36] Process of electroless copper plating on Al2O3 ceramics and its soldering at low temperature
    Zhang, Deku
    Wang, Kehong
    Yang, Zhimin
    Zhou, Weiwei
    Hanjie Xuebao/Transactions of the China Welding Institution, 2008, 29 (04): : 33 - 36
  • [37] Study on electroless copper plating
    Hua Dong Li Gong Da Xue/J East China Univ Sci Technol, 3 (367-371):
  • [38] Optimization of Catalyzing Process on Ta Substrate for Copper Electroless Deposition Using Electrochemical Method
    Lim, Taeho
    Koo, Hyo-Chol
    Park, Kyung Ju
    Kim, Myung Jun
    Kim, Soo-Kil
    Kim, Jae Jeong
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2012, 159 (03) : D142 - D147
  • [39] Influence of heat treatment on the microstructure and properties of electroless copper plating on aln substrate
    Hao, Yang-Yang
    Lin, Ying-Fei
    Gao, Wei
    Zheng, Kai-Hong
    Wang, Hai-Yan
    Zheng, Zhi-Bin
    Chen, Heng
    Surface Technology, 2020, 49 (02): : 288 - 294
  • [40] Optimising Electroless Copper Plating Parameters on Insulative Substrate for Enhanced Efficiency and Quality
    Gan, Yuyin
    Ong, Jun Du
    Lee, Swee Kah
    Wan, Tatt Wai
    Low, Siew Chun
    JOURNAL OF PHYSICAL SCIENCE, 2024, 35 (02) : 85 - 95
12345