Process Optimization of Electroless Copper Plating on Alumina Ceramics Substrate

被引：0
|
作者：
机构：
[1] Zheng, Qiang
[2] Cai, Wei
[3] Chen, Fei
[4] Zhou, Jie
[5] Lan, Wei
[6] Fu, Chun-Lin
来源：
Cai, Wei | 1600年 / Chongqing Wujiu Periodicals Press卷 / 46期
关键词：
531.1 Metallurgy - 804.1 Organic Compounds - 804.2 Inorganic Compounds - 812.1 Ceramics - 921.5 Optimization Techniques - 931.2 Physical Properties of Gases; Liquids and Solids - 933.1 Crystalline Solids - 943.2 Mechanical Variables Measurements - 951 Materials Science;
D O I：
10.16490/j.cnki.issn.1001-3660.2017.04.034
中图分类号：
学科分类号：
摘要：
15
引用
收藏
相关论文
共 50 条
  • [21] An alternative process for electroless copper plating on polyester fabric
    Guo, R. H.
    Jiang, S. Q.
    Yuen, C. W. M.
    Ng, M. C. F.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2009, 20 (01) : 33 - 38
  • [22] Investigation of process parameters in electroless copper plating on polystyrene
    Dev, Atul
    Tandon, Smriti
    Jha, Pankaj
    Singh, Prithipal
    Dutt, Anup
    SADHANA-ACADEMY PROCEEDINGS IN ENGINEERING SCIENCES, 2020, 45 (01):
  • [23] Investigation of process parameters in electroless copper plating on polystyrene
    Atul Dev
    Smriti Tandon
    Pankaj Jha
    Prithipal Singh
    Anup Dutt
    Sādhanā, 2020, 45
  • [24] Growth process of electroless plating copper on plastic surface
    College of Material Science and Engineering, Hefei University of Technology, Hefei, China
    不详
    Cailiao Rechuli Xuebao, (166-170):
  • [25] Optimization of barrel plating process for electroless Ni-P plating
    Hong, In Kwon
    Kim, Hyungjin
    Lee, Seung Bum
    JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, 2014, 20 (05) : 3767 - 3774
  • [26] Evaluation of substrate (Ni)-catalyzed electroless gold plating process
    Osaka, T
    Misato, T
    Sato, J
    Akiya, H
    Homma, T
    Kato, M
    Okinaka, Y
    Yoshioka, O
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (03) : 1059 - 1064
  • [27] Electroless Nickel Plating Process Optimization for Aluminum Terminals
    Westby, Philip
    Mattson, Kevin
    Haring, Fred
    Baer, Jacob
    Steele, Matt
    Ahmad, Syed Sajid
    Reinholz, Aaron
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 371 - 378
  • [28] Control system and process optimization for electroless nickel plating
    Qiao, Yingtai
    Hou, Jian
    Lai, Min
    Fang, Fengzhou
    NANOTECHNOLOGY AND PRECISION ENGINEERING, 2025, 8 (02):
  • [29] Effects of Ultrasonic Process on the Adhesion of Cu/Non-Conductive PCB Substrate in Electroless Copper Plating
    Kang, Ju-Suk
    Lee, Jinuk
    Kwon, Hyun-Woo
    Lee, Jae-Ho
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 30 - 32
  • [30] Effects of Potassium Ferrocyanide on Electroless Copper Plating Using Polymethylmethacrylate as Substrate
    Yu, Dan
    Wang, Ze-Hong
    Li, Wei-Ya
    Wang, Wei
    2016 INTERNATIONAL CONFERENCE ON MATERIALS SCIENCE AND ENGINEERING APPLICATION (ICMSEA 2016), 2016, : 399 - 405
12345