Process Optimization of Electroless Copper Plating on Alumina Ceramics Substrate

被引:0
|
作者
机构
[1] Zheng, Qiang
[2] Cai, Wei
[3] Chen, Fei
[4] Zhou, Jie
[5] Lan, Wei
[6] Fu, Chun-Lin
来源
Cai, Wei | 1600年 / Chongqing Wujiu Periodicals Press卷 / 46期
关键词
531.1 Metallurgy - 804.1 Organic Compounds - 804.2 Inorganic Compounds - 812.1 Ceramics - 921.5 Optimization Techniques - 931.2 Physical Properties of Gases; Liquids and Solids - 933.1 Crystalline Solids - 943.2 Mechanical Variables Measurements - 951 Materials Science;
D O I
10.16490/j.cnki.issn.1001-3660.2017.04.034
中图分类号
学科分类号
摘要
15
引用
收藏
相关论文
共 50 条
  • [1] DIRECT ELECTROLESS COPPER PLATING ON ALUMINA CERAMICS
    HONMA, H
    KOUCHI, Y
    PLATING AND SURFACE FINISHING, 1990, 77 (06): : 54 - 58
  • [2] Electroless nickel plating process and properties of alumina ceramics
    Zheng, Xiao-Hui
    Shan, Dong-Dong
    Song, Hao
    Ye, Xiong
    Wu, Di
    Tan, Jun
    Surface Technology, 2017, 46 (10): : 128 - 134
  • [3] ELECTROLESS NICKEL PLATING ON ALUMINA CERAMICS
    HONMA, H
    KANEMITSU, K
    PLATING AND SURFACE FINISHING, 1987, 74 (09): : 62 - 67
  • [4] Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating
    Chen, Jin-ju
    Guo, Yan-long
    Wang, Yan
    Zhang, Jing
    Li, Huo-jun
    Feng, Zhe-sheng
    JOURNAL OF MATERIALS CHEMISTRY C, 2016, 4 (43) : 10240 - 10245
  • [5] Study of a pre-treatment process for electroless copper plating on ceramics
    Ma, Hongfang
    Liu, Zhibao
    Wu, Ling
    Wang, Yihan
    Wang, Xixia
    THIN SOLID FILMS, 2011, 519 (22) : 7860 - 7863
  • [6] Novel copper electroless plating process on ceramic substrate using copper oxide particles
    Yanagimoto, H
    Akamatsu, K
    Deki, S
    Gotoh, K
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2002, 5 (09) : C87 - C89
  • [7] An ecofriendly electroless copper plating process
    Bhatgadde, LG
    Joseph, S
    TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 1997, 6 (01): : 55 - 60
  • [8] Metallization of a LTCC substrate by electroless copper plating
    Wang, Y
    Liu, Y
    Ma, JS
    Geng, ZT
    Huang, JC
    RARE METAL MATERIALS AND ENGINEERING, 2003, 32 : 614 - 617
  • [9] An ecofriendly electroless copper plating process
    Bhatgadde, LG
    Joseph, S
    TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 1996, 5 (04): : 55 - 60
  • [10] Activation of Ceramics by Nickel Nanoparticles for Electroless Copper Plating
    Ma Hongfang
    Ding Yanguang
    Ren Yuan
    Liu Wenfei
    Ma Fang
    Wang Xiaorui
    RARE METAL MATERIALS AND ENGINEERING, 2013, 42 : 509 - 512